ANSYS Electronics Suite 2024 R2

ANSYS has announced the release of Ansys Electronics 2024 R1. This solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before.

What's New in Ansys Electronics Desktop 2024 R1
Ansys Electronics Desktop (AEDT) provides highly integrated electromagnetic simulators, circuit/system simulation, ECAD links, and compliance reporting. The single desktop allows users to insert and co-simulate among multiple design types.

Electronics Desktop
– New view navigation controls
– Open MPI support extended to all relevant products in AEDT
– CPython connection to AEDT through gRPC
– Shared web licensing support for Pro, Premium, and Enterprise
– Animation export to Ensight format
– Improved display precision for near-zero floating point values
– Dark and light themes (Beta, Windows only)
– Ansys Cloud Gateway job management from AEDT (Beta)
– Web client for batch solve monitoring and reporting (Beta)
3D Modeler
– Copy-paste of designs with encrypted components
– Discovery 3D Modeler live connection
– Granta material attribute import from CAD files
– Improvements to subregions
– Lightweight geometry import through Discovery
– Integrated Hoops translators (Beta)
HFSS
– Array metadata export
– Array mask automation through CSV import
– SBR+ Antenna blockage with dielectric objects and VRT
– SBR+ PTD/UTD wedge editing improvement
– Memory usage improvement for Distributed Matrix Assembly
– Automatic prediction of the upper multipaction power threshold
– Distributed Sparse Direct Solver: Partial solve without grouping port unknowns
– Layout Component in 3D enhancements (Beta)
– Flex PCB support for Layout component in 3D (Beta)
– Q3D DCR in HFSS 3D (Beta)
– Composite subgroup in network analysis (Beta)
HFSS 3D Layout
– Multizone support for Layout components
– Usability and performance enhancements
– Rigid Flex workflow enhancements
– IC mode enhancements
– Encrypted technology support in IC mode
– SIwave Near Field simulation in 3D Layout (Beta)
– Extensions to EDB CPython API (Beta)
– Q3D in 3D Layout IC mode (Beta)
– RaptorX in 3D Layout IC mode (Beta)
Icepak
– AEDT Icepak import into Workbench
– PCB workflow enhancements
– Cylindrical orthotropic properties
– Post-processing and reporting enhancements
– Slider bar meshing enhancements
– Enhanced expression support
– Solar loading per object
– Official release of improved mesh regions
– ECXML import/export speed enhancements
– Thermal Mesh Fusion (Beta)
– GPU Computing for Solver (Beta)
Maxwell
– Litz twisting effects on DC resistance
– Magnetostriction enhancements
– NVH workflow for inverter-fed electric motors
– Nonlinear resistive sheet for 3D magnetostatic solution
– Shell element for modeling thin conductors
– Support value boundary for magnetostatic DDM solution
– Magnetostriction enhancements to initial stress
– Improve core loss calculations with Hysteresis Core Loss Model
– Enhancements to Maxwell Machine Toolkit with Motor-CAD post processing
– Support for Voltage in Maxwell-Fluent co-simulation for Electric Arc application
– Python API for custom core loss definition
– 2D Motor symmetry meshing enhancements
– Support loss adaptive refinement for eddy current solution (Beta)
– Layout Component in 3D Enhancements (Beta)
– Flex PCB Support for Layout Component in 3D (Beta)
– Expression cache calculations with light weight post processor (Beta)
AEDT Mechanical
– Official release of Transient Thermal
– Enabled AEDT Mechanical import into Workbench
– Layout component with trace mapping in Thermal and Structural (Beta)
– Enhanced Layout component gridcut slider & visualization (Beta)
Q3D Extractor
– Commercial release of distributed memory solver for CG
– Commercial release of transition region solver
– Enhanced multi-face uniform current terminals in DC-R
– MLFMM for improved AC-RL solver performance

Circuit

General Enhancements:
– Custom terminations
– New TDR analysis options
– Support for EMI receiver CISPR25
– Semiconductor characterization tool
– Transient diagnostic tools
– Motor model(s) for power electronics
– Add terminal names for RLGC PSpice sub-circuit
– Enhanced DDR5 support in Nexxim: AMI support for clock-forwarded architectures
– Print all top-level node voltages checkbox on transient/dc analysis menu
– New MIPI C-PHY transmitter component (Beta)
SPISim Enhancements:
– Add optimization mechanism and associated GUI settings to CTLE AMI models
– Enable RX_CLOCK of IBIS 7.1 for DDR5
– Add back-channel interface (BCI) for future TX/RX co-optimization
– Batch mode support for IBIS modeling flow and other usage improvements
FilterSolutions
– Balanced filter export to AEDT
EMIT
– Optimal N-to-1 feature and improvements
– Maintain and access multiple channel-level results
– Enable/disable radios and emitters
– Improved STK-EMIT integration/automation
– MIPI C-PHY Toolkit
Twin Builder
– PSPICE performance improvements
– Battery Wizard enhancements
– HPPC fitting error display in Battery Wizard
– Export State Space Model to Modelica Package
– Using conservative pins to connect thermal LTI-ROMs
– Parametric field history in Static ROM Builder
– LS-OPT/LS-DYNA ROM extraction and export
– Optimization algorithms for parameter calibration
– Improved useability for fusion workflow
– TD Composer workflow improvements
– PyTwin: Enhance 3D data handling with TBROM
Granta
– 44 new Materials Data for Simulation (MDS) records:
– 10 magnet materials
– 1 solder resist material
– 16 polymer grades
– 17 PCB laminates
– Updated record names for Panasonic Megtron 7 and Ventec tec-speed 6.0

 
Product:ANSYS Electronics Suite 2024 R2
Lanaguage:english
Platform:Win/Linux
Size:3DVD